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Key FactsTSMC Launches European Chip Factory with Key Partners
Aug 8, 2023 · Reading time: ~45 sec.
Summary created with AI assistance · Source: tomshardware.com
Summary created with AI assistance · Source: tomshardware.com
- TSMC collaborates with Bosch, Infineon, and NXP to form the European Semiconductor Manufacturing Company for a new fab in Germany.
- The facility will manufacture chips using 12nm, 16nm, 22nm, and 28nm-class process technologies for automotive and industrial applications.
- It is designed to serve German and Austrian automakers and industrial clients with a monthly capacity of approximately 40,000 300-mm wafers.
- Construction is scheduled to start in mid-2024 with production commencing by late 2027, with TSMC owning 70% and partners holding 10% each.
"Infineon will use the new capacity to serve the growing demand particularly of its European customers, especially in automotive and IoT," said Jochen Hanebeck, CEO of Infineon Technologies. "The advanced capabilities will provide a basis for developing innovative technologies, products and solutions to address the global challenges of decarbonization and digitalisation."— Jochen Hanebeck, CEO of Infineon Technologies
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